Previous (2025) Exhibitors’ Presentation

Exhibitors will introduce their featured products and technologies in a seminar format.
The seminar is free of charge and no prior registration is required.
It will be held within the exhibition hall. Please make sure to complete your visitor registration for entry to the exhibition in advance.

<Exhibitors’ Product/Technology Seminar ~New Tech Trend~>

Israeli technologies revolutionizing Automotive Industry

Exhibitors/Participants from Israel Pavilion

 

Jan. 22 (Wed) 11:00 - 13:30 Venue: East Hall 6

CONNECTED CAR JAPAN

Development of Flexible Metal Hoses for R744 for PFAS ban

Witzenmann Japan K.K.

Development on the Flexible Metal Hoses for High-Pressure Environments in R744 A/C Systems Exempt from PFAS Regulations

Jan. 22 (Wed) 13:00 - 13:30 Venue: East Hall 4

CAR-MECHA JAPAN

DX in the Transport Business: Learning from Case Studies

ascend, LTD.

We will explain how to proceed with the entire transportation DX.

Jan. 22 (Wed) 13:00 - 13:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

Promote automation by Bridgestone softrobotics

Bridgestone Softrobotics Ventures 

Introducing soft robot hand "TETOTE", that can grasp objects of various shapes and sizes, along with use cases.

Jan. 22 (Wed) 14:00 - 14:30 Venue②, South Hall (2nd Floor)

RoboDEX

ST's Next-Generation Automotive Battery Management Products

STMicroelectronics K.K.

This seminar introduces an overview of ST's latest BMS products and methods for more accurate battery life estimation.

Jan. 22 (Wed) 14:00 - 14:30 Venue: East Hall 6

CAR-ELE JAPAN

Suction tape removal machine for SMT parts, Drying furnace

Rexxam CO., LTD.

We will introduce our new machine that removes the suction tape on SMT parts and our new space-saving drying furnace.

Jan. 22 (Wed) 15:00 - 15:30 Venue: East Hall 3

ELECTROTEST JAPAN

Customer Centric Service Design Driven by SDV

NTT DATA Group Corporation 

NTT DATA's global experts will explore the harmony of innovative technologies with evolving customer experiences in SDV.

Jan. 22 (Wed) 15:00 - 15:30 Venue: East Hall 6

MaaS Expo

 Robot introduction guide

Seino Information Service CO., LTD.

Explanation of what needs to be done before automating logistics sites

Jan. 22 (Wed) 15:00 - 15:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

A2MAC1's approach for software costing

A2Mac1 Japan LTD.

A2MAC1's approach for software costing

Jan. 22 (Wed) 16:00 - 16:30 Venue: East Hall 6

EV JAPAN

Plasma joining for aluminum casting & high-tensile steel

STANLEY Engineered Fastening 

How plasma joining for multi-material can transform EV production

Jan. 23 (Thur) 11:00 - 11:30 Venue: East Hall 4

EV JAPAN

10x Expansion in Robotaxi & Consumer Car by End-to-End Model

DeepRoute.ai LTD.

With end-to-end model, smart driving cars and Robotaxis can drive anywhere, scale faster and more cost-effective. 

Jan. 23 (Thur) 11:00 - 11:30 Venue: East Hall 6

Autonomous Driving Technology Expo

Latest PECVD Solutions for Wide Bandgap Power Devices?

KLA CORPORATION

This talk will highlight the key PECVD process steps and solutions for SiC and GaN power devices.

Jan. 23 (Thur) 11:00 - 11:30 Venue: East Hall 3

ELECTROTEST JAPAN

Energy and Labor Savings with Model Predictive Control

Proxima Technology INC.

Discover how Model Predictive Control achieves energy savings and labor reduction, backed by real manufacturing results.

Jan. 23 (Thur) 11:00 - 11:30 Venue①, South Hall (2nd Floor)

SMART FACTORY Expo

Seminar on UNECE R10.07 (Latest Version)

TUV Rheinland Japan LTD.

EMC Regulations for Automotive Products, UNECE R10.07 Draft Revision Points will be explained

Jan. 23 (Thur) 12:00 - 12:30 Venue: East Hall 4

EV JAPAN

Mobility Innovation: Challenges of AI x Next-Generation LBS

Computer Engineering & Consulting LTD.

We will propose new LBS solutions utilizes AI for the future of the mobility industry, which requires transformation.

Jan. 23 (Thur) 12:00 - 12:30 Venue: East Hall 6

MaaS Expo

CVD diamond heat spreaders for high-power semiconductors

Quod6 CO., LTD.

CVD diamond heat spreaders are demonstrated to improve thermal and RF performance of high power GaN-on-SiC amplifiers.

Jan. 23 (Thur) 12:00 - 12:30 Venue: East Hall 3

FINE PROCESS TECHNOLOGY EXPO

Decoding SDVs: Insights, Innovations, & Impact

L&T Technology Services LTD LTD.

Discover how LTTS's SDV framework is revolutionizing mobility, exploring key aspects and future trends to stay ahead!

Jan. 23 (Thur) 13:00 - 13:00 Venue: East Hall 6

SOFTWARE-DEFINED VEHICLE EXPO

Regulatory Trends in AI, autonomous driving and Charging

TUV Rheinland Japan LTD.

AI Regulatory Law to be Promulgated in 2024, AI Law in Vehicle Automation, autonomous Driving and Charging

Jan. 23 (Thur) 13:00 - 13:30 Venue: East Hall 4

EV JAPAN

High Reliability Materials for Power Semiconductor Module

Resonac CORP.

Introduction of High Reliability Materials for Power Semiconductor Modules Under The Increasing Trend of Power Density

Jan. 23 (Thur) 13:00 - 13:30 Venue: East Hall 7

POWER DEVICE & MODULE EXPO

Dispensing technology and liquid materials for SDGs

MUSASHI ENGINEERING, INC.

Introducing dispensing technology's role in SDGs and methods tailored to liquid material characteristics.

Jan. 23 (Thur) 13:00 - 13:30 Venue: East Hall 3

INTERNEPCON JAPAN

Design and  Production Site Reforms for Smart Factory

NEC Nexsolutions, LTD.

Manage technical information to achieve smart factories and transform companies to be resilient to market changes.

Jan. 23 (Thur) 13:00 - 13:30 Venue①, South Hall (2nd Floor)

SMART FACTORY Expo

トラック簿・ハコベルDXシステムの事例・機能紹介

HACOBELL INC.

トラック予約受付システム『トラック簿』とハコベルDXシステム『配車管理』『配車計画』の事例と機能をご説明いたします

Jan. 23 (Thur) 13:00 - 13:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

Uncertainty Quantification (UQ) for Reliable AI Predictions

Keisoku Engineering System CO., LTD.

UQ provides probabilistic methods for integrating real/simulated data and assessing AI prediction reliability.

Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 7

POWER DEVICE & MODULE EXPO

Release film for semiconductors: No PFAS, Less cleaning

Harima Chemicals Group, INC.

Our advanced release film for semiconductors is PFAS-free, fit for face up/down molding and reduces cleaning frequency.

Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 3

ELECTRONIC COMPONENTS & MATERIALS EXPO

Specific logistics improvement measures to be taken in 2025

Seino Information Service CO., LTD.

Explaining the direction of solving our company's issues based on the results of the "Logistics Improvement Survey"

Jan. 23 (Thur) 14:00 - 14:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

Latest developments of Android Automotive for vehicles

FPT Japan Holdings  CO., LTD.

Android Automotive redefines in-vehicle experiences. Explore P3’s expertise in AAOS for cars, trucks, and motorcycles.

Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 6

SOFTWARE-DEFINED VEHICLE EXPO

NFTLP ensures high-temperature operation of SiC

Senju Metal Industry CO., LTD.

We have developed a NFTLP bonding material that exhibits high heat resistance. We will introduce its features.

Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 4

CAR-ELE JAPAN

The latest trend of EMS industry

VTech Communications LTD.

World wide EMS/ODM provider VTech will introduce latest trend of EMS industry.

Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 3

PWB EXPO

AI-powered BMS for better, safer and greener batteries

Eatron Technologies LTD.

Discover how AI-powered BMS can revolutionize battery performance, safety, and longevity for a greener future.

Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 6

SOFTWARE-DEFINED VEHICLE EXPO

High Reliability Low Temp Solders for AI & Auto Applications

Indium Corporation 

Mixed alloy technology to improve thermal, electrical, and mechanical reliability of solder joints by reducing defects. 

Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 7

POWER DEVICE & MODULE EXPO

Innovation with AI×MI! The Impact of Formulation Recipe Sim

NEC Nexsolutions, LTD.

Introducing Clovernet AI: For Addressing Labor Shortages, Enhancing Productivity, and Ensuring Quality Stability

Jan. 23 (Thur) 15:00 - 15:30 Venue①, South Hall (2nd Floor)

SMART FACTORY Expo

Labor Management in the Transportation Industry

ascend, LTD.

We will explain the points that are likely to be caught in labor management practices.

Jan. 23 (Thur)15:00 - 15:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

BorgWarner's battery systems for commercial vehicles.

BorgWarner 

BorgWarner's battery systems product portfolio drives innovation and commercial vehicle efficiency.

Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 4

EV JAPAN

Why did 3 European OEMs select Valens' A-PHY connectivity?

Valens Semiconductor LTD.

This PPT will review aspects of standard industry EMI testing and will review additional testing employed by OEMs.

Jan. 23 (Thur)16:00 - 16:30 Venue: East Hall 6

CONNECTED CAR JAPAN

Best-in-Class Blind Rivet Nut for IPX7 and Automation

STANLEY Engineered Fastening 

POP Nut Mech Seal eliminates O-Rings, simplifies assembly, and meets IPX7 standards for high-strength application

Jan. 24 (Fri) 11:00 - 11:30 Venue: East Hall 4

EV JAPAN

MP-Connect:MES solutions that combine efficiency and quality

Panasonic Production Engineering CO., LTD.

MP-Connect is a MES solution that supports DX at production sites that achieves both efficiency and quality.

Jan. 24 (Fri) 11:00 - 11:30 Venue①, South Hall (2nd Floor)

SMART FACTORY Expo

Service-Oriented Diagnostics: The Future of E/E Architecture

FPT Japan Holdings  CO., LTD.

Learn how Service-Oriented Vehicle Diagnostics, remote diagnostics, and OTA updates innovate software-defined vehicles.

Jan. 24 (Fri) 11:00 - 11:30 Venue: East Hall 6

SOFTWARE-DEFINED VEHICLE EXPO

increasing manufacturing output by advanced technology

Applied Materials INC.

Applied Materials shares manufacturing automation use cases in the semiconductor industry. Topics include cloud and AI.

Jan. 24 (Fri) 12:00 - 12:30 Venue①, South Hall (2nd Floor)

SMART FACTORY Expo

Dangers in paper and Excel operations

ascend, LTD.

We will explain “why” paper and Excel-based allocation

Jan. 24 (Fri) 12:00 - 12:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

SMIC Group's Initiatives to Move Towards a PFAS-Free Society

Senju Metal Industry CO., LTD.

We will introduce our PFAS analysis and newly developed PFAS-free fire extinguishing agents and soldering materials.

Jan. 24 (Fri) 12:00 - 12:30 Venue: East Hall 4

CAR-ELE JAPAN

How to Validate Software in an Evolving Automotive Ecosystem

HCL JAPAN LTD.

ADAS SW verification is a non-competitive field, so it's important to do efficiently. This will cover how to do this.

Jan. 24 (Fri) 12:00 - 12:30 Venue: East Hall 6

SOFTWARE-DEFINED VEHICLE EXPO

Transform site with planning! Is your lead time appropriate?

BitQuark CO., LTD.

Learn how to optimize lead times by revising production plans and process design with a production simulator.

Jan. 24 (Fri) 13:00 - 13:30 Venue①, South Hall (2nd Floor)

SMART FACTORY Expo

Introducing non-pressure sinter paste for copper substrates.

NIHON HANDA CO., LTD.

Introducing "MAX4022", a non-pressure high-strength sinter paste, plus time-saving products "MAX534" and "MAX5342".

Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 7

IC & SENSOR PACKAGING EXPO

Automation with FANUC's easy-to-use collaborative robots

FANUC CORPORATION

We will introduce automation with easy-to-use collaborative robots for first-time users, digital twins, IoT, and AI.

Jan. 24 (Fri) 13:00 - 13:30 Venue②, South Hall (2nd Floor)

RoboDEX

Frontloading of EMC design and Immunity Analysis Method

CybernetSystems CO., LTD.

We will introduce Frontloading of EMC design using CAE and Immunity Analysis Method that is becoming more important

Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 4

CAR-ELE JAPAN

Utilization of MOD Inks in Next-Gen Semiconductor Packaging

Electroninks INC.

MOD-INK IN Package Substrate
Solution proposal by iSAP (ink Semi Additive Process) as Seed layer

Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 3

INTERNEPCON JAPAN

Smart, Secure, Connected:The SDV Era

HCLTech 

Delve into comprehensive approach, seamlessly integrating chip-to-cloud tech to enable intelligent, connected vehicles.

Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 6

SOFTWARE-DEFINED VEHICLE EXPO

Turning logistics data into power - Conata case study

FLYWHEEL INC.

How can logistics data drive management and decisions? Explore the future of logistics warehouses via the KDDI case.

Jan. 24 (Fri) 14:00 - 14:30 Venue①, South Hall (2nd Floor)

SMART LOGISTICS Expo

Electronics is the key to manage vehicle's carbon footprint

ACTIA Japan K.K.

ACTIA introduces EcoMatrix provides assessment of Electronics product's ecological impact, especially carbon emissions.

Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 6

CONNECTED CAR JAPAN

Foreign Matter Countermeasure Technology

Creative Technology  CORP.

We will introduce our foreign matter countermeasure technology with examples.

Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 7

POWER DEVICE & MODULE EXPO

Noise/thermal design starts with PCB current mapping (AC/DC)

Ultimate Technologies INC.

PCB heat management, thermal design, analytical methods, and concepts for efficient heat dissipation routes.

Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 3

INTERNEPCON JAPAN

 Robot introduction guide

Seino Information Service CO., LTD.

Explanation of what needs to be done before automating logistics sites

Jan. 24 (Fri) 14:00 - 14:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

GenAI in Automotive Innovation: Leading Innovation Insights

NTT DATA Group Corporation 

Pioneers in Digital Innovation share insights on GenAI's prospects, exploring its transformative impact on the industry.

Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 4

MaaS Expo

Step-by-Step Deployment of SRF Wireless Platform in Factory

Flexible Factory Partner Alliance 

Introducing step-by-step deployment scenarios for SRF which aims to ensure stable wireless communication in factories.

Jan. 24 (Fri) 15:00 - 15:30 Venue①, South Hall (2nd Floor)

SMART FACTORY Expo

Top WES Vendor Explains Key Points for Choosing Systems

YE DIGITAL CORP.

Leading WESvendor shares insights on warehouse automation,covering system renewal toWES adoption for seamless operations

Jan. 24 (Fri) 15:00 - 15:30 Venue②, South Hall (2nd Floor)

SMART LOGISTICS Expo

Innoviz LiDAR as key sensor for ADAS and Autonomous Driving

Innoviz Technologies LTD.

What is the LiDAR's key role in Advanced Driver Assistance Systems and Autonomous Driving will be explored in detail.

Jan. 24 (Fri) 15:00 - 15:30 Venue: East Hall 6

CAR-ELE JAPAN

Improving UI testing efficiency with Figma and Eggplant.

Systena CO.

We will reduce the effort from design to testing and demonstrate its effectiveness through a car navigation demo.

Jan. 24 (Fri) 16:00 - 16:30 Venue: East Hall 6

MaaS Expo

<Green Factory Forum>

Thermoacoustic cooling system that utilizes unused heat

CENTRAL MOTOR WEEL CO., LTD.

We would like to introduce a new product, the thermoacoustic cooling system, that can be used to utilize waste heat.

Jan. 22 (Wed) 13:00 - 13:30 Venue①, South Hall (2nd Floor)

GREEN FACTORY Expo

Effects and Ex of Heat-insulation paint that achieves CN

RAKUTO CO., LTD.

We will introduce the effects and performance of heat-insulating paint with examples of factories and warehouses

Jan. 22 (Wed) 14:00 - 14:30 Venue①, South Hall (2nd Floor)

GREEN FACTORY Expo

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