Previous (2025) Exhibitors’ Presentation
Exhibitors will introduce their featured products and technologies in a seminar format.
The seminar is free of charge and no prior registration is required.
It will be held within the exhibition hall. Please make sure to complete your visitor registration for entry to the exhibition in advance.
<Exhibitors’ Product/Technology Seminar ~New Tech Trend~>
Israeli technologies revolutionizing Automotive Industry
Exhibitors/Participants from Israel Pavilion
Jan. 22 (Wed) 11:00 - 13:30 Venue: East Hall 6
CONNECTED CAR JAPAN
Development of Flexible Metal Hoses for R744 for PFAS ban
Witzenmann Japan K.K.
Development on the Flexible Metal Hoses for High-Pressure Environments in R744 A/C Systems Exempt from PFAS Regulations
Jan. 22 (Wed) 13:00 - 13:30 Venue: East Hall 4
CAR-MECHA JAPAN
DX in the Transport Business: Learning from Case Studies
ascend, LTD.
We will explain how to proceed with the entire transportation DX.
Jan. 22 (Wed) 13:00 - 13:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
Promote automation by Bridgestone softrobotics
Bridgestone Softrobotics Ventures
Introducing soft robot hand "TETOTE", that can grasp objects of various shapes and sizes, along with use cases.
Jan. 22 (Wed) 14:00 - 14:30 Venue②, South Hall (2nd Floor)
RoboDEX
ST's Next-Generation Automotive Battery Management Products
STMicroelectronics K.K.
This seminar introduces an overview of ST's latest BMS products and methods for more accurate battery life estimation.
Jan. 22 (Wed) 14:00 - 14:30 Venue: East Hall 6
CAR-ELE JAPAN
Suction tape removal machine for SMT parts, Drying furnace
Rexxam CO., LTD.
We will introduce our new machine that removes the suction tape on SMT parts and our new space-saving drying furnace.
Jan. 22 (Wed) 15:00 - 15:30 Venue: East Hall 3
ELECTROTEST JAPAN
Customer Centric Service Design Driven by SDV
NTT DATA Group Corporation
NTT DATA's global experts will explore the harmony of innovative technologies with evolving customer experiences in SDV.
Jan. 22 (Wed) 15:00 - 15:30 Venue: East Hall 6
MaaS Expo
Robot introduction guide
Seino Information Service CO., LTD.
Explanation of what needs to be done before automating logistics sites
Jan. 22 (Wed) 15:00 - 15:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
A2MAC1's approach for software costing
A2Mac1 Japan LTD.
A2MAC1's approach for software costing
Jan. 22 (Wed) 16:00 - 16:30 Venue: East Hall 6
EV JAPAN
Plasma joining for aluminum casting & high-tensile steel
STANLEY Engineered Fastening
How plasma joining for multi-material can transform EV production
Jan. 23 (Thur) 11:00 - 11:30 Venue: East Hall 4
EV JAPAN
10x Expansion in Robotaxi & Consumer Car by End-to-End Model
DeepRoute.ai LTD.
With end-to-end model, smart driving cars and Robotaxis can drive anywhere, scale faster and more cost-effective.
Jan. 23 (Thur) 11:00 - 11:30 Venue: East Hall 6
Autonomous Driving Technology Expo
Latest PECVD Solutions for Wide Bandgap Power Devices?
KLA CORPORATION
This talk will highlight the key PECVD process steps and solutions for SiC and GaN power devices.
Jan. 23 (Thur) 11:00 - 11:30 Venue: East Hall 3
ELECTROTEST JAPAN
Energy and Labor Savings with Model Predictive Control
Proxima Technology INC.
Discover how Model Predictive Control achieves energy savings and labor reduction, backed by real manufacturing results.
Jan. 23 (Thur) 11:00 - 11:30 Venue①, South Hall (2nd Floor)
SMART FACTORY Expo
Seminar on UNECE R10.07 (Latest Version)
TUV Rheinland Japan LTD.
EMC Regulations for Automotive Products, UNECE R10.07 Draft Revision Points will be explained
Jan. 23 (Thur) 12:00 - 12:30 Venue: East Hall 4
EV JAPAN
Mobility Innovation: Challenges of AI x Next-Generation LBS
Computer Engineering & Consulting LTD.
We will propose new LBS solutions utilizes AI for the future of the mobility industry, which requires transformation.
Jan. 23 (Thur) 12:00 - 12:30 Venue: East Hall 6
MaaS Expo
CVD diamond heat spreaders for high-power semiconductors
Quod6 CO., LTD.
CVD diamond heat spreaders are demonstrated to improve thermal and RF performance of high power GaN-on-SiC amplifiers.
Jan. 23 (Thur) 12:00 - 12:30 Venue: East Hall 3
FINE PROCESS TECHNOLOGY EXPO
Decoding SDVs: Insights, Innovations, & Impact
L&T Technology Services LTD LTD.
Discover how LTTS's SDV framework is revolutionizing mobility, exploring key aspects and future trends to stay ahead!
Jan. 23 (Thur) 13:00 - 13:00 Venue: East Hall 6
SOFTWARE-DEFINED VEHICLE EXPO
Regulatory Trends in AI, autonomous driving and Charging
TUV Rheinland Japan LTD.
AI Regulatory Law to be Promulgated in 2024, AI Law in Vehicle Automation, autonomous Driving and Charging
Jan. 23 (Thur) 13:00 - 13:30 Venue: East Hall 4
EV JAPAN
High Reliability Materials for Power Semiconductor Module
Resonac CORP.
Introduction of High Reliability Materials for Power Semiconductor Modules Under The Increasing Trend of Power Density
Jan. 23 (Thur) 13:00 - 13:30 Venue: East Hall 7
POWER DEVICE & MODULE EXPO
Dispensing technology and liquid materials for SDGs
MUSASHI ENGINEERING, INC.
Introducing dispensing technology's role in SDGs and methods tailored to liquid material characteristics.
Jan. 23 (Thur) 13:00 - 13:30 Venue: East Hall 3
INTERNEPCON JAPAN
Design and Production Site Reforms for Smart Factory
NEC Nexsolutions, LTD.
Manage technical information to achieve smart factories and transform companies to be resilient to market changes.
Jan. 23 (Thur) 13:00 - 13:30 Venue①, South Hall (2nd Floor)
SMART FACTORY Expo
トラック簿・ハコベルDXシステムの事例・機能紹介
HACOBELL INC.
トラック予約受付システム『トラック簿』とハコベルDXシステム『配車管理』『配車計画』の事例と機能をご説明いたします
Jan. 23 (Thur) 13:00 - 13:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
Uncertainty Quantification (UQ) for Reliable AI Predictions
Keisoku Engineering System CO., LTD.
UQ provides probabilistic methods for integrating real/simulated data and assessing AI prediction reliability.
Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 7
POWER DEVICE & MODULE EXPO
Release film for semiconductors: No PFAS, Less cleaning
Harima Chemicals Group, INC.
Our advanced release film for semiconductors is PFAS-free, fit for face up/down molding and reduces cleaning frequency.
Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 3
ELECTRONIC COMPONENTS & MATERIALS EXPO
Specific logistics improvement measures to be taken in 2025
Seino Information Service CO., LTD.
Explaining the direction of solving our company's issues based on the results of the "Logistics Improvement Survey"
Jan. 23 (Thur) 14:00 - 14:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
Latest developments of Android Automotive for vehicles
FPT Japan Holdings CO., LTD.
Android Automotive redefines in-vehicle experiences. Explore P3’s expertise in AAOS for cars, trucks, and motorcycles.
Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 6
SOFTWARE-DEFINED VEHICLE EXPO
NFTLP ensures high-temperature operation of SiC
Senju Metal Industry CO., LTD.
We have developed a NFTLP bonding material that exhibits high heat resistance. We will introduce its features.
Jan. 23 (Thur) 14:00 - 14:30 Venue: East Hall 4
CAR-ELE JAPAN
The latest trend of EMS industry
VTech Communications LTD.
World wide EMS/ODM provider VTech will introduce latest trend of EMS industry.
Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 3
PWB EXPO
AI-powered BMS for better, safer and greener batteries
Eatron Technologies LTD.
Discover how AI-powered BMS can revolutionize battery performance, safety, and longevity for a greener future.
Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 6
SOFTWARE-DEFINED VEHICLE EXPO
High Reliability Low Temp Solders for AI & Auto Applications
Indium Corporation
Mixed alloy technology to improve thermal, electrical, and mechanical reliability of solder joints by reducing defects.
Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 7
POWER DEVICE & MODULE EXPO
Innovation with AI×MI! The Impact of Formulation Recipe Sim
NEC Nexsolutions, LTD.
Introducing Clovernet AI: For Addressing Labor Shortages, Enhancing Productivity, and Ensuring Quality Stability
Jan. 23 (Thur) 15:00 - 15:30 Venue①, South Hall (2nd Floor)
SMART FACTORY Expo
Labor Management in the Transportation Industry
ascend, LTD.
We will explain the points that are likely to be caught in labor management practices.
Jan. 23 (Thur)15:00 - 15:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
BorgWarner's battery systems for commercial vehicles.
BorgWarner
BorgWarner's battery systems product portfolio drives innovation and commercial vehicle efficiency.
Jan. 23 (Thur) 15:00 - 15:30 Venue: East Hall 4
EV JAPAN
Why did 3 European OEMs select Valens' A-PHY connectivity?
Valens Semiconductor LTD.
This PPT will review aspects of standard industry EMI testing and will review additional testing employed by OEMs.
Jan. 23 (Thur)16:00 - 16:30 Venue: East Hall 6
CONNECTED CAR JAPAN
Best-in-Class Blind Rivet Nut for IPX7 and Automation
STANLEY Engineered Fastening
POP Nut Mech Seal eliminates O-Rings, simplifies assembly, and meets IPX7 standards for high-strength application
Jan. 24 (Fri) 11:00 - 11:30 Venue: East Hall 4
EV JAPAN
MP-Connect:MES solutions that combine efficiency and quality
Panasonic Production Engineering CO., LTD.
MP-Connect is a MES solution that supports DX at production sites that achieves both efficiency and quality.
Jan. 24 (Fri) 11:00 - 11:30 Venue①, South Hall (2nd Floor)
SMART FACTORY Expo
Service-Oriented Diagnostics: The Future of E/E Architecture
FPT Japan Holdings CO., LTD.
Learn how Service-Oriented Vehicle Diagnostics, remote diagnostics, and OTA updates innovate software-defined vehicles.
Jan. 24 (Fri) 11:00 - 11:30 Venue: East Hall 6
SOFTWARE-DEFINED VEHICLE EXPO
increasing manufacturing output by advanced technology
Applied Materials INC.
Applied Materials shares manufacturing automation use cases in the semiconductor industry. Topics include cloud and AI.
Jan. 24 (Fri) 12:00 - 12:30 Venue①, South Hall (2nd Floor)
SMART FACTORY Expo
Dangers in paper and Excel operations
ascend, LTD.
We will explain “why” paper and Excel-based allocation
Jan. 24 (Fri) 12:00 - 12:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
SMIC Group's Initiatives to Move Towards a PFAS-Free Society
Senju Metal Industry CO., LTD.
We will introduce our PFAS analysis and newly developed PFAS-free fire extinguishing agents and soldering materials.
Jan. 24 (Fri) 12:00 - 12:30 Venue: East Hall 4
CAR-ELE JAPAN
How to Validate Software in an Evolving Automotive Ecosystem
HCL JAPAN LTD.
ADAS SW verification is a non-competitive field, so it's important to do efficiently. This will cover how to do this.
Jan. 24 (Fri) 12:00 - 12:30 Venue: East Hall 6
SOFTWARE-DEFINED VEHICLE EXPO
Transform site with planning! Is your lead time appropriate?
BitQuark CO., LTD.
Learn how to optimize lead times by revising production plans and process design with a production simulator.
Jan. 24 (Fri) 13:00 - 13:30 Venue①, South Hall (2nd Floor)
SMART FACTORY Expo
Introducing non-pressure sinter paste for copper substrates.
NIHON HANDA CO., LTD.
Introducing "MAX4022", a non-pressure high-strength sinter paste, plus time-saving products "MAX534" and "MAX5342".
Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 7
IC & SENSOR PACKAGING EXPO
Automation with FANUC's easy-to-use collaborative robots
FANUC CORPORATION
We will introduce automation with easy-to-use collaborative robots for first-time users, digital twins, IoT, and AI.
Jan. 24 (Fri) 13:00 - 13:30 Venue②, South Hall (2nd Floor)
RoboDEX
Frontloading of EMC design and Immunity Analysis Method
CybernetSystems CO., LTD.
We will introduce Frontloading of EMC design using CAE and Immunity Analysis Method that is becoming more important
Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 4
CAR-ELE JAPAN
Utilization of MOD Inks in Next-Gen Semiconductor Packaging
Electroninks INC.
MOD-INK IN Package Substrate
Solution proposal by iSAP (ink Semi Additive Process) as Seed layer
Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 3
INTERNEPCON JAPAN
Smart, Secure, Connected:The SDV Era
HCLTech
Delve into comprehensive approach, seamlessly integrating chip-to-cloud tech to enable intelligent, connected vehicles.
Jan. 24 (Fri) 13:00 - 13:30 Venue: East Hall 6
SOFTWARE-DEFINED VEHICLE EXPO
Turning logistics data into power - Conata case study
FLYWHEEL INC.
How can logistics data drive management and decisions? Explore the future of logistics warehouses via the KDDI case.
Jan. 24 (Fri) 14:00 - 14:30 Venue①, South Hall (2nd Floor)
SMART LOGISTICS Expo
Electronics is the key to manage vehicle's carbon footprint
ACTIA Japan K.K.
ACTIA introduces EcoMatrix provides assessment of Electronics product's ecological impact, especially carbon emissions.
Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 6
CONNECTED CAR JAPAN
Foreign Matter Countermeasure Technology
Creative Technology CORP.
We will introduce our foreign matter countermeasure technology with examples.
Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 7
POWER DEVICE & MODULE EXPO
Noise/thermal design starts with PCB current mapping (AC/DC)
Ultimate Technologies INC.
PCB heat management, thermal design, analytical methods, and concepts for efficient heat dissipation routes.
Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 3
INTERNEPCON JAPAN
Robot introduction guide
Seino Information Service CO., LTD.
Explanation of what needs to be done before automating logistics sites
Jan. 24 (Fri) 14:00 - 14:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
GenAI in Automotive Innovation: Leading Innovation Insights
NTT DATA Group Corporation
Pioneers in Digital Innovation share insights on GenAI's prospects, exploring its transformative impact on the industry.
Jan. 24 (Fri) 14:00 - 14:30 Venue: East Hall 4
MaaS Expo
Step-by-Step Deployment of SRF Wireless Platform in Factory
Flexible Factory Partner Alliance
Introducing step-by-step deployment scenarios for SRF which aims to ensure stable wireless communication in factories.
Jan. 24 (Fri) 15:00 - 15:30 Venue①, South Hall (2nd Floor)
SMART FACTORY Expo
Top WES Vendor Explains Key Points for Choosing Systems
YE DIGITAL CORP.
Leading WESvendor shares insights on warehouse automation,covering system renewal toWES adoption for seamless operations
Jan. 24 (Fri) 15:00 - 15:30 Venue②, South Hall (2nd Floor)
SMART LOGISTICS Expo
Innoviz LiDAR as key sensor for ADAS and Autonomous Driving
Innoviz Technologies LTD.
What is the LiDAR's key role in Advanced Driver Assistance Systems and Autonomous Driving will be explored in detail.
Jan. 24 (Fri) 15:00 - 15:30 Venue: East Hall 6
CAR-ELE JAPAN
Improving UI testing efficiency with Figma and Eggplant.
Systena CO.
We will reduce the effort from design to testing and demonstrate its effectiveness through a car navigation demo.
Jan. 24 (Fri) 16:00 - 16:30 Venue: East Hall 6
MaaS Expo
<Green Factory Forum>
Thermoacoustic cooling system that utilizes unused heat
CENTRAL MOTOR WEEL CO., LTD.
We would like to introduce a new product, the thermoacoustic cooling system, that can be used to utilize waste heat.
Jan. 22 (Wed) 13:00 - 13:30 Venue①, South Hall (2nd Floor)
GREEN FACTORY Expo
Effects and Ex of Heat-insulation paint that achieves CN
RAKUTO CO., LTD.
We will introduce the effects and performance of heat-insulating paint with examples of factories and warehouses
Jan. 22 (Wed) 14:00 - 14:30 Venue①, South Hall (2nd Floor)
GREEN FACTORY Expo
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